UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE T-flex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy llows the material to "totally blanket" the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. T-flex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures. T-flex 300-H is offered with a hard, metallized liner option for easy handling and improved rework.

The metllized liner's lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. T-flex 300-TG is offered with a cut-through resistant T-gardTM silicone liner. The TG liner offers a guaranteed dieletric barrier, and easier part handling for mass production. FEATURES AND BENEFITS Extreme compliancy allows material to "totally blanket" component (s) Thermal conductivity of 1.2 W/mK Available in thicknesses from 0.020". 0.200" (. 5mm - 5.0 mm) Low compression set enables the pad to be reused many times APPLICATIONS Notebook and desktop computers Telecommunication hardware Hard disk drives, DVDs Flat Panel Displays Memory modules Power conversion equipment Set top box