Made from acrylic, the TG Scraper features a narrow tip specifically developed to remove, for example, silicone adhesive from the package (PCB) of a delidded processor or residual indium solder from the CPU dies. The ergonomic design ensures a firm and secure grip during use.
Note: Careful and precise handling of the TG Scraper is essential to avoid damaging small electronic components on the CPU package or the dies. When removing indium solder from the die (s), it is recommended to first gently scrape the surface with the TG Scraper, then clean remaining solder residue from the die surfaces using liquid metal.