The efficient and professional thermal management solutions
Our thermal paste is made of organosilicone polymer and high thermal conductivity nanocomposite materials, with a variety of additives, processed and prepared by the technical team's unique technology. It gives full play to the size effect and interface effect of nanocomposite materials, thus prominently improving the thermal conductivity and stability, and continuously providing customers with excellent, efficient and professional thermal management experience.
User Guides:
1. Clean up the surface.
2. Use Thermal Grease on the CPU surface center.
3. Using scraper or other tools to smear the thermal paste onto the CPU.
4. After coating the product, the thickness is based on A3 paper thickness.
Specification:
Thermal Conductivity: 6.5/12.8W/m-k
Thermal Resistance: 0.03°C-in²/W
Wide operating temperature: -60-250
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Safe Application
The computer can work better after using thermal paste. It does not contain any metallic particles, so electrical conductivity would not be an issue. Unlike silver and copper compounds, it can contact any electrical pins that would not damage any sort.
Excellent Performance
The compound is composed of carbon micro-particles which lead to an extremely high thermal conductivity. It makes that heat generated from the CPU or GPU is dissipated quickly and efficiently, even suitable for overclocking. Superb in performance, Foriston ranks among the top thermal compound, thermal paste, or thermal grease in the market.
Easy to Apply
With an ideal consistency, the Thermal Compound Paste is very easy to use, even for beginners. The possibilities for its application and the most effectively way to avoid voids between CPU and cooler we show in the video.