MAX MCR -Electronic Grade Potting Compound 4 Circuit Board, PCB Encapsulating, Embedding, Opaque Black Masking, Thin, Injectable, 1.5 Inch Thick Casting, Low Exotherm, Medium Set Time, 1.5 Gallon Kit

Electronic potting and encapsulating compound for printed circuit boards. It insulates AC/DC high and low voltage. It bonds to ABS PVC plastic housing, wire jackets, mold injected components, powder coated and metal substrates. This non-electrically conductive epoxy resin is for waterproofing and embedding electronic components. It is opaque black for permanent masking. It cures at room temperature with a 2:1 mix ratio and a medium setting. It cures to a very rigid state, with an operating temperature up to 190°F (90°C)