Common questions (FAO);
Q: What models of Raspberry Pi does this box support?
A: Supports Raspberry Pi B+, 2B, 3B, 3B+.
Q: Will the metal box affect the Wi-Fi signal?
A: It will have a slight effect. It is impossible that it will not affect the normal use at all.
Q: How many colors does this box have?
A: Black one colors are optional.
Q: Can this box be customized?
A: It can be customized for customers. Please consult customer service for specific customization requirements, customization quantity (500 or more per share) and customization price.
Q: What is the size and weight of this box?
A: The
box size is: 9.0 x 6.5 x 2.6CM; weight: 118 grams.
The new aluminum alloy shell uses the heat dissipation column chip contact and the shell to form a large heat dissipation body of the box. Generally, a layer of thermal conductive silicone grease or a heat dissipation pad should be applied to the contact surface between the electronic components and the heat sink during use, so that the heat generated by the components can be more effectively transferred to the shell, and then dissipated to the surrounding air through the shell, which greatly increases the contact area with the air, so that the heat dissipation effect is better than that of ordinary heat sinks.
Q: What models of Raspberry Pi does this box support?
A: Supports Raspberry Pi B+, 2B, 3B, 3B+.
Q: Will the metal box affect the Wi-Fi signal?
A: It will have a slight effect. It is impossible that it will not affect the normal use at all.
Q: How many colors does this box have?
A: Black one colors are optional.
Q: Can this box be customized?
A: It can be customized for customers. Please consult customer service for specific customization requirements, customization quantity (500 or more per share) and customization price.
Q: What is the size and weight of this box?
A: The
box size is: 9.0 x 6.5 x 2.6CM; weight: 118 grams.
The new aluminum alloy shell uses the heat dissipation column chip contact and the shell to form a large heat dissipation body of the box. Generally, a layer of thermal conductive silicone grease or a heat dissipation pad should be applied to the contact surface between the electronic components and the heat sink during use, so that the heat generated by the components can be more effectively transferred to the shell, and then dissipated to the surrounding air through the shell, which greatly increases the contact area with the air, so that the heat dissipation effect is better than that of ordinary heat sinks.
