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Specifications: Bleed < 0.05% at 150 Degree C/24 Hours
Evaporation < 0.001% at 150 Degree C/24 Hours
Specific Gravity > 1.7 at Degree C
Thermal Conductivity > 1.93 W/m-K at 25 Degree C
Thermal Resistance < 0.120 Degree C-in2/W at 25 Degree C
Operating Temperature: -30 to 180 Degree C (-22 to 356 Degree F)
Color: Silver
Materials: Silicone Compounds 50%, Carbon Compounds 30%, Metal Oxide Compounds 20%
Product Length: 2.6 in [67 mm]
Product Weight: 0.4 oz [10 g]
Product Width: 0.8 in [20 mm]
Included in Package: 1 x 1.5g Tube of Silver Based Thermal Grease
Features: Metal-based compound containing metal oxide
Thermal conductivity of more than 1.93 W/m-K
Negligible electrical conductivity
Stable performance over a wide temperature range
4-6 a...
Specifications: CORSAIR TM30 thermal paste helps you push your PC to its limit, with a low-viscosity premium zinc oxide thermal material that’s easy to apply. TM30’s ultra-low thermal impedance ensures high-efficiency heat transfer between your hardware and cooler, lowering temperatures and allowing for higher clock speeds.
Net Weight: 3g
Thermal Conductivity: 3.8 W/mK
Thermal Impedance: 0.01°C -in2/W
Viscosity: 2300K cPs
Specific Gravity: 2.5g/cm3
Features: Enthusiast CPU Thermal Compound: Premium Zinc Oxide based thermal compound for optimal thermal performance
Cools your CPU and GPU: Install new, or replace existing thermal compound on your CPU and GPU to improve heat transfer and lower temperatures
Impr...
Specifications: Material Specification:
Al 70~88(wt%)
ZnO 15~27(wt%)
Oil 11~19(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 250000Cps (Viscosity)
Thermal Conductivity: 10.2 W/m - Degree C
Thermal Impedance (Resistance): 0.015 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread spoon
Specific Gravity: 2.5g/cm3
Features: AMAZON #1 BESTSELLER: The MX-4 convinces everyone with its usual quality and performance, that have always distinguished it
EXCELLENT PERFORMANCE: Composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently
HIGH PERFORMANCE: With excellent temperature reduction performance, the MX-4 is ideal for CPU and GPU cooling, and other applications between power semiconductor components and heatsinks
SAFE APPLICATION: The MX-4 is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards
HIGH DURABILITY: In contrast to metal and silicon thermal compound, the MX-4 doesn't compromise over t...
Features: GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to ensure ultimate conductivity, perfect gap filling and optimal viscosity. It is also non-electrical conductive and included an additional applicator for super easy application.
Long Term Operating Temperature: -250 °C / +150 °C
Specifications: The Thermal Grizzly Carbonaut pad is a carbon fiber thermal pad. Its special developed polymer results in its flexibility and its soft 'gap filler' properties. The carbon fiber structure ensures excellent thermal conductivity. Thermal Grizzly Carbonaut is lightweight and reusable. In addition, Thermal Grizzly Carbonaut has a very high thermal conductivity even with very little contact pressure. Thermal Grizzly Carbonaut heat transfer performance always remains constant. Note: Carbonaut is electrically conductive.
Carbonaut is available pre-assembled in many standard CPU / GPU sizes.
Size - CPU/GPU
32 x 32 - Intel Desktop CPUs (115x) e.g 6700K, 7700K, 9900K
38 x 38 - Intel 20xx HEDT CPUs and AMD Desktop CPUs. e.g. 7900X, 7980XE, 2700X, 1800X, 6950X
51 x...