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Specifications: Bleed < 0.05% at 150 Degree C/24 Hours
Evaporation < 0.001% at 150 Degree C/24 Hours
Specific Gravity > 1.7 at Degree C
Thermal Conductivity > 1.93 W/m-K at 25 Degree C
Thermal Resistance < 0.120 Degree C-in2/W at 25 Degree C
Operating Temperature: -30 to 180 Degree C (-22 to 356 Degree F)
Materials: Silicone Compounds 50%, Carbon Compounds 30%, Metal Oxide Compounds 20%
Product Length: 2.6 in [67 mm]
Product Weight: 0.4 oz [10 g]
Product Width: 0.8 in [20 mm]
Included in Package: 1 x 1.5g Tube of Silver Based Thermal Grease
Specifications: • Ultra-high CPU/GPU conductivity (11 W/m-K) • NanoDiamond particles maintains through a wide range of temperatures? • ?Excellent viscosity makes it easy to spread or remove without cracking or drying out • Enhanced User Experience Design • Precise and Even • Easy to spread and remove without surface damage • Grease cleanser included for easy cleaning away old thermal grease.
Specifications: High CPU/GPU conductivity (5 W/m-K)
Specific Gravity(25?): 2.6
Improves heat transfer from chipset to cooler base or heatpipes
Enhanced User Experience Design
Precise and Even
Easy to spread and remove without surface damage
Grease cleanser included for easy cleaning away old thermal grease.
Specifications: Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: -50 Degrees C to >180 Degrees C
Long-Term: -50 Degrees C to 130 Degrees C
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.