Built for How Business Buys.
Built for How Business Buys.
Thermal Grizzly's Mycro Pro Stainless Steel CPU water block for Intel sockets LGA1700, LGA1851 and LGA1954 (Mycro Pro ST Intel 1700/1851/1954).
The block consists of three primary components: a copper base plate, a stainless steel cooler plate that forms the body, and an anodized aluminum frame. It is connected to a custom water-cooling loop via two ports in the stainless steel body, one inlet and one outlet, both with standardized G1/4-inch threads. The sealing rings (O-rings) are made from EPDM (ethylene propylene diene rubber), which is highly elastic and resistant to ozone and UV radiation.
The cold plate is bare copper. It is not nickel-plated, and Thermal Grizzly left the plating off in order to provide the best possible transfer of heat from the processor into the loop. Since the block is mounted on the Integrated Heatspreader (IHS), where liquid metal is generally not used, a barrier layer formed by nickel is not necessarily required. Eliminating the nickel-plating process from the manufacturing chain also reduces the production cost of the cooler, resulting in what Thermal Grizzly calls a very good price-to-performance ratio. The trade is looks. While bare copper slightly improves performance compared with a nickel-plated cold plate, it may discolor due to oxidation. Skin contact accelerates the oxidation and the resulting discoloration, so the block should only be handled by the anodized aluminum frame.
Thermal Grizzly's Ultra-High-Performance Coldplates, used on its CPU and graphics card water blocks, are milled with minimal and highly optimized channel and fin widths. In the case of this block, the channel and fin widths on the unplated copper are each 0.2 mm, and a total of 70 microfins are located on the base plate. This high number of thin fins provides the coolant with a very large surface area, across which it can dissipate heat quickly and efficiently. In Thermal Grizzly's in-house test, on a Watercool MO-RA3 radiator, the block held a Core Ultra 9 285K fixed at 5.4 GHz and 1.4 V at an average 61.6 C under full load. That is about 260 W at 2.35 l/min, almost twice the heat of a stock 285K.
The flow inlet has been optimized for LGA1851 with a stock heatspreader, but the block can also be used with LGA1700 CPUs. It is compatible with the Intel High Performance Heatspreader V1 (for socket LGA1700). It is not suitable for Direct-Die use. For a delidded chip use the Mycro Direct-Die Pro for LGA1700 or LGA1851. The G1/4-inch threads of the inlet and outlet ports are each 6 mm deep, and with two ports the block takes two compression fittings, such as the DeltaMate 16/10.