Thermal Grizzly Hydronaut Pro - 2g - Yellow Thermal Paste (TG-HP-002-R)

Thermal Grizzly Hydronaut Pro is a silicone-free thermal paste for CPUs, GPUs, notebooks and ICs, made for large-surface heat sinks such as custom water cooling. This is the 2g version. The paste is available in 2g, 6g, and 30g sizes, so the others are 6g and 30g.

Properties

• Amount: 2g
• Carrier: Silicone-free
• Electrical conductivity: 0 pS/m
• Color: Neon green
• Typical application: CPUs, GPUs, notebooks, ICs
• Boxed: 12g gross, 10 x 19.6 x 1.5 cm

Who it is for

It is sold as a premium paste, engineered without silicone for industrial applications, high-performance PCs, and demanding cooling environments. Its outstanding thermal conductivity suits large-surface coolers and heat spreaders, and it is optimized for systems with custom water cooling. That makes it an ideal choice for workstations and gaming PCs, whether you're building a custom water-cooled gaming system, assembling a workstation or maintaining industrial equipment. Overclocking is covered too: the data sheet names overclocked processors and processors with a high TDP in watts (Intel Core i5/i7, AMD Ryzen 5/7). Thermal Grizzly describes the price-performance ratio as attractive. Its other silicone-free paste is Hydronaut.

Silicone-free formulation

Unlike conventional thermal compounds, this one utilizes a carrier structure that features no silicone. Many thermal pastes rely on silicone-based oils (e.g., siloxanes) as the carrier fluid or as a component of the matrix. Under repeated thermal cycling those oils can separate or migrate, potentially causing bleeding over time. Micro-movements between the CPU IHS and the cooler base can intensify this, and the mechanical displacement of paste from the contact surface is referred to as the pump-out effect. While this is generally not an issue in consumer PCs, industrial environments often require silicone-free materials. Leaking oil can be incompatible with seals, gaskets, and other sensitive components nearby (e.g., certain EPDM or NBR seals), leading to swelling or changes in material properties. Doing without the use of silicone-based carrier oils is meant to prevent those compatibility issues, and the paste is resistant to pump-out caused by thermal cycling. It is also RoHS compliant, making it suitable for professional applications where material compatibility is critical.

Heat transfer and long-term stability

Its advanced formulation minimizes thermal interface resistance while maintaining excellent adhesion between the processor and cooler. The result is efficient heat transfer: the paste delivers consistent cooling even under heavy workloads, combining that with dependable performance in the long run. The paste remains electrically non-conductive for safe installation. It needs no curing and no hardening sets in: it will not harden over time, ensuring reliable performance throughout the life of the system.

Applying it

For precise application, the package includes both the standard TG Spatula and the redesigned TG Spatula Pro, next to the applicator. The improved design of the Pro spatula allows greater pressure while spreading. That makes it easier to achieve an exceptionally thin and uniform application layer, which is what gives maximum thermal performance. Both spatulas are part of the package contents listed below.

In the box

• 1x Hydronaut Pro 2g
• 1x Applicator
• 1x TG Spatula
• 1x TG Spatula Pro