Product Features
High Performance
High temperature resistance
Low thermal resistance
Non-Electrical Conductive
Non-corrosive ,Non-toxic
Working principle
Filling the gape between heating element and the cooling device, Increasing the contact area so as to achieve the soundest thermal conductivity effect.
Helps disperse the heat from CPU to heatsink effectively.
Wide range application
Suitable for: CPU, GPU ,heatsink, ovens, chipset, Xbox, High power LED and other components.
Excellent ease of use and outstanding long-term stability.