Specifications: Wire Size: 28 Gauge
Latch Style: Pull Type
Directional: No
Connector: SFF-8088
Impedance: 100 Ohms
Compliant: SAS-2.1
Type: Passive
Transfer Rate: 6 Gb/s
Dimensions (WxHxD) 0.30" x 0.20" x 39.37"
8 mm x 5 mm x 1,000 mm
Specifications: Wire Size: 30 Gauge
Latch Style: Press Type
Directional: No
Connector: SFF-8087
Impedance: 100 Ohms
Compliant: SAS-2.1
Type: Passive
Transfer Rate: 6 Gb/s
Dimensions (WxHxD) 0.30" x 0.20" x 29.53"
8 mm x 5 mm x 750 mm
Specifications: Wire Size: 30 Gauge
Latch Style: Press Type
Directional: No
Connector: SFF-8087
Impedance: 100 Ohms
Compliant: SAS-2.1
Type: Passive
Transfer Rate: 6 Gb/s
Dimensions (WxHxD) 0.30" x 0.20" x 19.69"
8 mm x 5 mm x 500 mm
Specifications: Wire Size: 30 Gauge
Latch Style: Pull Type
Directional: No
Connector: SFF-8088 to SFF-8087
Impedance: 100 Ohms
Compliant: SAS-2.1
Type: Passive
Transfer Rate: 6 Gb/s
Dimensions (WxHxD) 0.30" x 0.20" x 39.37"
8 mm x 5 mm x 1,000 mm
Specifications: Wire Size: 28 Gauge
Latch Style: Pull Type
Directional: No
Connector: SFF-8644
Impedance: 100 Ohms
Compliant: SAS-3.0
Type: Passive
Transfer Rate: 12 Gb/s
Dimensions (WxHxD) 0.30" x 0.20" x 39.37"
8 mm x 5 mm x 1,000 mm
Specifications: Wire Size: 30 Gauge
Latch Style: Press Type
Directional: No
Connector: SFF-8643
Impedance: 100 Ohms
Compliant: SAS-3.0
Type: Passive
Transfer Rate: 12 Gb/s
Dimensions (WxHxD) 0.30" x 0.20" x 19.69"
8 mm x 5 mm x 500 mm
Specifications: Wire Size: 30 Gauge
Latch Style: Pull Type
Directional: Yes, SFF-8644 to host
Connector: SFF-8644 to SFF-8482
Impedance: 100 Ohms
Compliant: SAS-3.0
Type: Passive
Transfer Rate: 12 Gb/s
Dimensions (WxHxD) 0.30" x 0.20" x 39.37"
8 mm x 5 mm x 1,000 mm
Specifications: Wire Size: 30 Gauge
Latch Style: Press Type
Directional: No
Connector: SFF-8087
Impedance: 100 Ohms
Compliant: SAS-2.1
Type: Passive
Transfer Rate: 6 Gb/s
Dimensions (WxHxD) 0.30" x 0.20" x 19.69"
8 mm x 5 mm x 500 mm
Features: This Copper Shims thermal conductivity up to 401w / mk, and ordinary copper thermal conductivity is only 20-30w / mk
CPU and GPU graphics card in the inside part of the laptop using a thermal plastic thermal conductivity, thermal plastic
at high temperature for a long time easy to aging, and ultimately lost, leading to overheating of the CPU or GPU, the
Laptop will not start after overheating. And this copper heat sink solve thermal problems caused by frequent crashes laptop, etc