The ICES675S Series is a COM Express Type 6-pinouts Basic module which featuring Intel® C240 series PCH chipset supports Intel® 8/9th Generation Intel® Core Processors, socket 1511 ,DDR4 with ECC or non-ECC SO-DIMM 2666MHZ up to 32GB. The ICES675S-NCB integrated Intel® HD Graphics engines support or expands via PCI Express Graphic 1 x 16 lanes and support three DDI (Digital Display Interface) to follow the standard of PICMG COM2.0 specification. It allows type 6-pinout Carrier board to implement DDI and legacy VGA interface.
The high performance ICES675 COM Express Basic Module supports 1 x GBE LAN, 4 x USB3.1 GEN1, 8 x USB2.0, 4 x SATA3.0, 2 x UART(TX/RX), HD Audio, 8 bit DIO, TPM (Optional) ICEB 8060 as well as customized solution for your embedded projects.
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Specifications
CPU / Chipset
- 8/9th Gen Intel® Core™ processors, socket 1151, PCH C246
Main Memory
- 2-Channel DDR4 with ECC or non-ECC SO-DIMM 2666MHZ up to 32GB
BIOS
- AMI (UEFI)
Display
- Integrated Intel Gen 9 Graphics graphic engine
- 1 x VGA connector (resolution up to 1920x1080@60Hz)
- 1 x LVDS connector(resolution up to 1920x1080@60Hz)
- DDI 1/2 Port configurable to HDMI1.4/DVI/Display port 1.4 HDMI up to 4096 x 2160@30Hz/24bpp, DVI up to 1920x1200@60Hz, DP up to 4096 x 2304 @ 60Hz
COM Express Connector
- AB :LVDS:(LVDS/eDP co-lay), VGA:(VGA/DDI port3 co-lay), 1 x GbE LAN, 6x PCIe x1, HD Audio, 4 x SATA III, 8 x USB2.0, LPC Bus, SM Bus/I2C, 2 x COM, GPIO 8bit
- CD : DDI1, DDI2, 1 x PCIe x16, 2 x PCIe x1, 4 x USB3.0
Power Requirement
- +12VDC, +5Vsb
OS Support Lists
- Windows 10
Dimensions
- 125mm x 95mm
Environment
- Board level operation temperture : -0°C to 60°C
- Storage temperture : -20C to 85C
- Relative humidty:
10% to 95% (operating, non-condensing)
5% to 95% (non-operating, non-condensing)
Certifications
- Meet CE / FCC Class B
Weight Information
- 1Kg
