• Ultra low-profile for excellent compatibility with larger components
  • Cost-efficient next-gen performance for designers and video editing
  • applications
  • Carefully selected superior quality ICs, without mixing memory IDM,
  • to guarantee exceptional performance and reliability
  • Silver aluminum heatsinks are made for maximum cooling
  • Programmed with Intel XMP 3.0 and AMD EXPO profiles, tested OC
  • speed can be reached by BlOS adjustments, depending on
  • motherboard, CPU capability, and compatibility
  • On-die ECC and PMIC for long-term data reliability, stability, and
  • efficient power supply
  • QVL approved and compatible with mainstream motherboards