Alphacool Apex Thermal Putty is a high-performance solution for thermally bonding heat-sensitive electronic components to the heatsink. As a non-curing silicone gel, it offers an electrically non-conductive alternative to traditional thermal pads and was specifically developed for applications where flexibility, low mechanical stress, and high thermal conductivity are crucial. A key advantage of Apex Thermal Putty lies in its optimal consistency for processing and dimensional stability. The material conforms perfectly to varying gap heights under slight pressure while maintaining its shape. This allows for reliable compensation of unevenness and tolerances between the cooler and component, ensuring optimal contact between the heat source and the heatsink at all times.
This is particularly important for modern graphics cards and other sensitive electronic components, as it protects delicate components such as memory chips and voltage regulators from damage. The sophisticated formula design of Alphacool Apex Thermal Putty combines high thermal conductivity with a reduced bond line thickness (BLT), thereby lowering thermal resistance and improving heat dissipation. Bond line thickness describes the thickness of the thermal interface material layer between the component and the heat sink. Simultaneously, the high vertical stability, combined with long-term stable material properties, ensures lasting material integrity without sagging, cracking, or contamination of adjacent components, making the product ideal for professional applications.
These properties result in a wide range of applications for Alphacool Apex Thermal Putty. Wherever reliable, flexible, and mechanically gentle heat transfer is required, Apex Putty offers a high-performance and future-proof solution. Technical DataFlow Rate (g/min)20 (Test method: 30 cc EFD cartridge / 2.5 mm nozzle, 90 psi)Density (g/cc) 3.8 (Test method: ASTM D792)Minimum bond line thickness (mm) 0.2 mm
This is particularly important for modern graphics cards and other sensitive electronic components, as it protects delicate components such as memory chips and voltage regulators from damage. The sophisticated formula design of Alphacool Apex Thermal Putty combines high thermal conductivity with a reduced bond line thickness (BLT), thereby lowering thermal resistance and improving heat dissipation. Bond line thickness describes the thickness of the thermal interface material layer between the component and the heat sink. Simultaneously, the high vertical stability, combined with long-term stable material properties, ensures lasting material integrity without sagging, cracking, or contamination of adjacent components, making the product ideal for professional applications.
These properties result in a wide range of applications for Alphacool Apex Thermal Putty. Wherever reliable, flexible, and mechanically gentle heat transfer is required, Apex Putty offers a high-performance and future-proof solution. Technical DataFlow Rate (g/min)20 (Test method: 30 cc EFD cartridge / 2.5 mm nozzle, 90 psi)Density (g/cc) 3.8 (Test method: ASTM D792)Minimum bond line thickness (mm) 0.2 mm
