For processors that are not soldered, delidding is typically used to replace the thermal interface material (TIM) between the CPU die and heat spreader with high-quality thermal paste or liquid metal before reattaching the heat spreader. However, since Intel Core Ultra 200 series processors are soldered, this is not an option, as removing the indium solder would create too large a gap between the IHS and the CPU dies. Therefore, Intel Core Ultra 200 CPUs are primarily delidded to allow for the direct mounting of the CPU cooler onto the CPU dies.
By omitting the heat spreader and mounting the cooler directly onto the dies, temperatures can typically be reduced by 10-15 °C when using liquid metal, such as Conductonaut, as the TIM.
Warning InstructionsNote: When delidding with the Intel 1851 Delid-Die-Mate V1, the CPU should be heated to 165°C (the melting point of indium is 157°C) to liquefy the indium, making it easier to remove the heat spreader. This minimizes mechanical stress on the chip and helps prevent damage. Otherwise, there is a high risk of damaging the CPU during delidding.
Caution: Removing the heat spreader (delidding) of a processor is done at your own risk! Delidding the CPU voids the manufacture


