The thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. The minus pad extreme is electrically insulating.
Due to the consistency only one-time use is recommended. The thermal conductivity was improved by about 260 % over the minus pad 8 which allows best cooling for tough cooling operations such as voltage regulators and memory ICs.
Most excellent thermal conductivity
No bleeding
long-term stability
high compression rate
within the capabilities of thermal pads
The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm.
Hardness Shore : 00 - 65
Thickness : 0,53,0 mm
Typical thickness tolerance : ± 0,1 mm
Flammability : V-0
Electically insulating : Ja (8 KV/mm ASTM D149)
Density : 3.38 g/cm³
Temperature Range : -100 °C / +200 °C
