The Intel High Performance Heatspreader V1 is an upgrade heatspreader for Intel processors. The nickel-plated copper heatspreader has a 207 percent larger, diamond-milled precision surface. This increased surface area compared to the original heatspreader enables maximum heat dissipation for air and water coolers, while the precision milling ensures extremely low surface roughness for the best contact with the heat sink. Replaces ILM and heatspreader207% larger surface areaMade from nickel-plated copperDiamond milled precision surfaceCompatible with air and water coolersCPU compatibility list available onlineOnly for delidded CPUs!
Attention: Loss of warrantyThe nickel-plated surface of the Intel High Performance Heatspreader V1 is compatible with traditional thermal pastes and gallium-based liquid metals. The nickel forms a barrier layer between the liquid metal and the copper cooler so that liquid metal does not diffuse into the copper and alloy formation is minimized. This means that multiple applications of liquid metal are generally not necessary. Note on the use of KryoSheet and mono blocksThe Intel High Performance Heatspreader V1 has been extensively tested internally in various application scenarios. During development, great emphasis was placed on stable operation of the processor and RAM. In our test series, KryoSheet in combination with the Intel High Performance Heatspreader V1 was unable to achieve any significant improvements in terms of temperature and was problematic in terms of contact pressure. For this reason, we cannot recommend the use of thermal pads because their additional thickness has a strong influence on the contact pressure and can therefore impair the function. When using mono blocks for the mainboard, the mounting height and thermal pads may need to be adjusted. It is important to check whether there is contact between the Intel High Performance Heatspreader V1 and the mono block.
If you have any questions, please co
Attention: Loss of warrantyThe nickel-plated surface of the Intel High Performance Heatspreader V1 is compatible with traditional thermal pastes and gallium-based liquid metals. The nickel forms a barrier layer between the liquid metal and the copper cooler so that liquid metal does not diffuse into the copper and alloy formation is minimized. This means that multiple applications of liquid metal are generally not necessary. Note on the use of KryoSheet and mono blocksThe Intel High Performance Heatspreader V1 has been extensively tested internally in various application scenarios. During development, great emphasis was placed on stable operation of the processor and RAM. In our test series, KryoSheet in combination with the Intel High Performance Heatspreader V1 was unable to achieve any significant improvements in terms of temperature and was problematic in terms of contact pressure. For this reason, we cannot recommend the use of thermal pads because their additional thickness has a strong influence on the contact pressure and can therefore impair the function. When using mono blocks for the mainboard, the mounting height and thermal pads may need to be adjusted. It is important to check whether there is contact between the Intel High Performance Heatspreader V1 and the mono block.
If you have any questions, please co
