^^ Diversion air duct: fin gap air duct, rapid heat loss, to ensure that the CPU at normal temperature rapid operation without delay. ^^ Copper sole brazing +CNC fine microsculpting convex process: all copper sole brazing process and nano graphene composite spraying process, more powerful performance. Effectively reduce the motherboard MOS tube and memory temperature 10~20.
^^ Precise sizing: The JF13K is large, and the JIUSHARK design team ensures precise compatibility between the memory and I/O panels by precisely designing the fin shapes.
^^ Compatibility: Intel LGA1700/1200/115X, AMD AM2/AM4/AM5 ^^
Note: motherboard width requirements MATX motherboard 235-245 width, ATX motherboard 235-245 width. Or a wider width motherboard. The installation direction must be the copper tube facing the graphics card.


