PRIME B560M-A AC is a mainstream motherboard launched by ASUS and is part of the PRIME B560M-A series.
Core parameters and functions
The PRIME B560M-A AC motherboard uses the Intel B560 chipset, supports 10th and 11th generation Intel Core processors, and has LGA 1200 slots. It is equipped with 4 DDR4 DIMM slots, supports up to 128GB of memory, supports dual channel DDR4 memory, and can reach a frequency of 5000MHz (overclocking). In addition, the motherboard also supports PCIe 4.0, providing efficient graphics and data processing capabilities.
Scalability and Interface
PRIME B560M-A AC offers a wide range of expansion interfaces, including 2 M. 2 slots (one of which supports PCIe 4.0 ), 6 SATA III interfaces, 1 USB 3.2 Gen 2 Type-C interface, and multiple USB 3.2 Gen 1 and USB 2.0 interfaces. These interfaces can meet the expansion needs of most users.
Heat dissipation and stability design
The motherboard adopts an 8+1 power supply module and DrMOS to ensure stable power supply. It is also equipped with a large heat sink and a 6-layer PCB design, providing better heat dissipation and enhanced stability. In addition, the motherboard also supports AURA Sync technology, and the programmable RGB lighting effect further enhances the personalized experience.
Core parameters and functions
The PRIME B560M-A AC motherboard uses the Intel B560 chipset, supports 10th and 11th generation Intel Core processors, and has LGA 1200 slots. It is equipped with 4 DDR4 DIMM slots, supports up to 128GB of memory, supports dual channel DDR4 memory, and can reach a frequency of 5000MHz (overclocking). In addition, the motherboard also supports PCIe 4.0, providing efficient graphics and data processing capabilities.
Scalability and Interface
PRIME B560M-A AC offers a wide range of expansion interfaces, including 2 M. 2 slots (one of which supports PCIe 4.0 ), 6 SATA III interfaces, 1 USB 3.2 Gen 2 Type-C interface, and multiple USB 3.2 Gen 1 and USB 2.0 interfaces. These interfaces can meet the expansion needs of most users.
Heat dissipation and stability design
The motherboard adopts an 8+1 power supply module and DrMOS to ensure stable power supply. It is also equipped with a large heat sink and a 6-layer PCB design, providing better heat dissipation and enhanced stability. In addition, the motherboard also supports AURA Sync technology, and the programmable RGB lighting effect further enhances the personalized experience.
