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Specifications: The thermal conductivity of CTG8D reaches 12.8W/mK, achieving above average performance on the market at a relatively moderate price. It can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards. The non-conductive formula completely avoids the risk of short circuit, and can be easily extended into a uniform thin layer (recommended thickness of 0.2mm) by single point extrusion, with simple operation. After curing, it can withstand temperatures ranging from -50 ° C to 250 ° C and is compatible with copper aluminum heat sinks, nickel plated heat pipes, and common me...
Specifications: The thermal conductivity of CTG10 thermal paste reaches 14.5W/mK, which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards. The non-conductive formula completely avoids the risk of short circuit, and can be easily extended into a uniform thin layer (recommended thickness of 0.2mm) by single point extrusion, with simple operation. After curing, it can withstand temperatures ranging from -50 ° C to 250 ° C and is compatible with copper aluminum heat sinks, nickel plated heat pipes, and common metal interfaces. Comes with a scraper, winning your trust with ext...