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Specifications: The thermal conductivity of CTG8D reaches 12.8W/mK, achieving above average performance on the market at a relatively moderate price. It can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming laptops, desktop computers, and mid-range graphics cards. The non-conductive formula completely avoids the risk of short circuit, and can be easily extended into a uniform thin layer (recommended thickness of 0.2mm) by single point extrusion, with simple operation. After curing, it can withstand temperatures ranging from -50 ° C to 250 ° C and is compatible with copper aluminum heat sinks, nickel plated heat pipes, and common me...
Specifications: TG-30 adopts an improved nanocarbon tube composite formula with a thermal conductivity of 17.5W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores and meet the cooling needs of mainstream gaming consoles, high-performance graphics cards, and workstations. Its non-conductive properties completely avoid the risk of short circuit,
Specifications: TG-50 adopts a composite formula of nano carbon tubes and liquid metal, with a thermal conductivity exceeding 18.2W/mK (measured value), which can quickly reduce the temperature difference between CPU/GPU cores by more than 25 ?,. Its non-conductive properties eliminate the risk of short circuits, and the viscosity is optimized to 150000 cP. Both single point and nine point coatings can quickly extend into ultra-thin and uniform layers. After curing, the temperature resistance range extends to -50 ?~250 ?, and long-term high-temperature operation does not cause dry cracking or carbonization. Adding rare earth antioxidants to achieve an 8-year performance degradation rate of l...