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Specifications: Bleed < 0.05% at 150 Degree C/24 Hours
Evaporation < 0.001% at 150 Degree C/24 Hours
Specific Gravity > 1.7 at Degree C
Thermal Conductivity > 1.93 W/m-K at 25 Degree C
Thermal Resistance < 0.120 Degree C-in2/W at 25 Degree C
Operating Temperature: -30 to 180 Degree C (-22 to 356 Degree F)
Color: Silver
Materials: Silicone Compounds 50%, Carbon Compounds 30%, Metal Oxide Compounds 20%
Product Length: 2.6 in [67 mm]
Product Weight: 0.4 oz [10 g]
Product Width: 0.8 in [20 mm]
Included in Package: 1 x 1.5g Tube of Silver Based Thermal Grease
Features: Metal-based compound containing metal oxide
Thermal conductivity of more than 1.93 W/m-K
Negligible electrical conductivity
Stable performance over a wide temperature range
4-6 a...
Specifications: CORSAIR TM30 thermal paste helps you push your PC to its limit, with a low-viscosity premium zinc oxide thermal material that’s easy to apply. TM30’s ultra-low thermal impedance ensures high-efficiency heat transfer between your hardware and cooler, lowering temperatures and allowing for higher clock speeds.
Net Weight: 3g
Thermal Conductivity: 3.8 W/mK
Thermal Impedance: 0.01°C -in2/W
Viscosity: 2300K cPs
Specific Gravity: 2.5g/cm3
Features: Enthusiast CPU Thermal Compound: Premium Zinc Oxide based thermal compound for optimal thermal performance
Cools your CPU and GPU: Install new, or replace existing thermal compound on your CPU and GPU to improve heat transfer and lower temperatures
Impr...
Specifications: Material Specification:
Al 70~88(wt%)
ZnO 15~27(wt%)
Oil 11~19(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 250000Cps (Viscosity)
Thermal Conductivity: 10.2 W/m - Degree C
Thermal Impedance (Resistance): 0.015 Degree C-in2/W
Included: One syringe of thermal compound and one easy-to-spread spoon
Specific Gravity: 2.5g/cm3
Features: Ultimate Heat Conductivity
Non-Electrical Conductive
Non-Corrosive & Non-Curring
No Bleeding & User Friendly
GELID Applicator
Net Content of 3.5g
Long Term Operating Temperature: -100 °C to +250 °C
Features: Description: Thermal Grizzly Minus Pad is a thermal pad made from modified silicone. The silicone is filled with metal oxides, thus ensuring remarkable thermal conductivity.
Properties: The Thermal Grizzly Minus Pad 8 is a soft gap filler, which is adhesive but easy to remove. The Thermal Grizzly Minus Pad 8 is insulating and sports very high thermal conductivity, even with very little contact pressure.
Standard Colour: The colour is a red-brown.
Shipping: The Thermal Grizzly Minus Pad 8 is currently available for end users in the following sizes: 100mm x 100mm, 120mm x 20mm and 30mm x 30mm.
Storage: Thermal Grizzly minus pad 8 should be stored in its original packaging at room temperature....
Specifications: Dimensions
50x50 mm or 145x145 mm(based on model)
Thickness
0.5 mm or 1.0 mm or 1.5 mm (based on model)
Thermal Conductivity
6.0 W/mK
Hardness
25 Shore 00
Specific Gravity
3.2 g/cm3
Colour
Blue
Continuous Use Temperature
-40~200 C
Volume resistance
1 X 1012 O-cm
Breakdown Voltage
12 KV/mm
Tensile strength
2.5 Kgf/cm²
Elongation
45 %
Specifications: Average Particle Size:
<0.49 micron <0.000020 inch
Extended Temperature Limits:
Peak: -50 Degrees C to >180 Degrees C
Long-Term: -50 Degrees C to 130 Degrees C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Long Term Operating Temperature: -150 °C / +200 °C
Specifications: Even though the amount of metallic elements in Aeronauts formula is lower in comparison to our other products, it still provides reliable and perfomant thermal conductivity.
In our lab tests, Aeronaut showed a high amount of wear resistance under high temperatures, and acts also surface-protecting. The removal of Aeronaut thermal grease causes far less micro scratches on the components surface compared to other products.
Features: GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to ensure ultimate conductivity, perfect gap filling and optimal viscosity. It is also non-electrical conductive and included an additional applicator for super easy application.
Features: AMAZON #1 BESTSELLER: The MX-4 convinces everyone with its usual quality and performance, that have always distinguished it
EXCELLENT PERFORMANCE: Composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently
HIGH PERFORMANCE: With excellent temperature reduction performance, the MX-4 is ideal for CPU and GPU cooling, and other applications between power semiconductor components and heatsinks
SAFE APPLICATION: The MX-4 is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards
HIGH DURABILITY: In contrast to metal and silicon thermal compound, the MX-4 doesn't compromise over t...