? Good Heat Dissipation Upgraded thermal silica gel material with 12 W/mK thermal conductivity our thermal pad greatly improve CPU / GPU/chipset / LED/ ic module and the heat sink Heat transfer between electronic components and effectively cool the temperature down in seconds. Perfect To Filled Contact Surfaces Gap effectively improve the heat transfer efficiency and also serve as insulation shock absorption and sealing Equal effect.? Widely UsedPerfectly replaces traditional heatsink compound grease paste great for Control board motor electronics CPU GPU Heat Sink Power LED 3d printerauto mechanics computer host laptop DVD VCD LID Set-top box LED IC SMD DIP and any cooling modules? Good Cooling Insulation Thermal Conductivity Wear Resistant Non Conductive Antistatic Fire Retardant Heat Resistance High Temperature Resistance Compression Buffering Etc.

Super Reliable Durable: In -40 -200 Range Does Not Melt Good Stability No Toxic Odorless No Corrosion No Stimulation No Damage To Metal Materials. It Can Be Arbitrarily Cut Size Easy To Install Replaces Traditional Heatsink Compound Grease Paste.? Thermal Silicone Pad Has A Thermal Conductivity Of 12 W/mk Dimension 100x100x 1.5 mm the thermal pads can be cut freely according to your needs? perfect to filled contact surfaces gap we committed to provide superior thermal pads easy to install feel free to contact us if there is any issue with our thermal pads.