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Specifications: Average Particle Size:
< 0.49 micron < 0.000020 inch
Extended Temperature Limits:
Peak: -50 Celsius Degree to >180 Celsius Degree
Long-Term: -50 Celsius Degree to 130 Celsius Degree
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
Coverage Area:
A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.
Features: Three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact...
Series: PTM7950 31x50x0.2mm Phase Change Thermal Pad
Thermal Conductivity: 8.5 W/mK
Features: PTM7950 is a highly thermally conductive Phase Change Material (PCM) that lasts longer and is more effective than tradiational thermal paste.
Size 31x50x0.2mm, Phase change at 45°C, Thermal Conductivity: 8.5 W/m.K, It is normal for it to melt at high temperatures.It achieves good heat dissipation performance through repeated melting and solidification. Note: it requires technical and operational skills, it is recommended to use under the guidance of professionals
PTM7950 is a proprietary material that provides superior reliability (pass 150°C baking 1000 hours, T/C-B 1000 cycles) and maintains low thermal impedance (<0.04°Ccm2/W @ no shim), making the PTM7950 series desirable for high performance integrated circuit devices.
PTM7950, ...